DAGE4800INTEGRA
BONDTESTER
Semiconductor Wafer Tester
클린룸 기반의 웨이퍼 핸들링 통합 모델
“DAGE4800INTEGRA는 많은 수량의 웨이퍼를 테스트를 클린, 안전하게 테스트하여 높은 테스트 처리량을 달성하고 있습니다.”
| COMPARISON of 4000OPTIMA and 4000PLUS | 4000OPTIMA | 4000PLUS |
| Usage | Production Bond Test | Advanced Bond Test |
| Precision | Very high precision | Very high precision |
| Typical product | Complex and high density components | Complex and high density components |
| Test capabilities and max loads | ||
| Pull | 50 kg | 100 kg |
| Shear | 200 kg | 200 kg |
| Cold bump pull | 5 kg | 10 kg |
| Zone shear | 20 kg | 20kg |
| Hot bump pull | 10kg | |
| Automation | ||
| Automation (joystick step and repeat) | ||
| Automation (camera assist) | (option) | |
| XY axis travel | ||
| 160 mm x 160 mm | ||
| 210 mm x 300 mm | (option) | (option) |
| 410 mm x 450 mm | ||
| XY speed | ||
| 2 mm/s | ||
| 3 mm/s | ||
| 6 mm/s | ||
| 50mm /s | ||
| Z axis travel + speed | ||
| 65 mm + 5 mm/s | ||
| 75 mm + 5mm/s | ||
| 200 mm 20 mm/s | ||
BONDTESTER
