DAGE4800INTEGRA
BONDTESTER
Semiconductor Wafer Tester
![BT 4800 INTEGRA (700×700)](https://nordko.com/wp-content/uploads/2020/06/BT-4800-INTEGRA-700x700-1.png)
클린룸 기반의 웨이퍼 핸들링 통합 모델
“DAGE4800INTEGRA는 많은 수량의 웨이퍼를 테스트를 클린, 안전하게 테스트하여 높은 테스트 처리량을 달성하고 있습니다.”
![](https://nordko.com/wp-content/uploads/2021/12/BondTest-Product-Overview-inte-300x300-1.png)
![](https://nordko.com/wp-content/uploads/2021/12/BondTest-Product-Overview-inte-300x300-2.png)
![](https://nordko.com/wp-content/uploads/2021/12/BondTest-Product-Overview-inte-300x300-3.png)
COMPARISON of 4000OPTIMA and 4000PLUS | 4000OPTIMA | 4000PLUS |
Usage | Production Bond Test | Advanced Bond Test |
Precision | Very high precision | Very high precision |
Typical product | Complex and high density components | Complex and high density components |
Test capabilities and max loads | ||
Pull | 50 kg | 100 kg |
Shear | 200 kg | 200 kg |
Cold bump pull | 5 kg | 10 kg |
Zone shear | 20 kg | 20kg |
Hot bump pull | 10kg | |
Automation | ||
Automation (joystick step and repeat) | ||
Automation (camera assist) | (option) | |
XY axis travel | ||
160 mm x 160 mm | ||
210 mm x 300 mm | (option) | (option) |
410 mm x 450 mm | ||
XY speed | ||
2 mm/s | ||
3 mm/s | ||
6 mm/s | ||
50mm /s | ||
Z axis travel + speed | ||
65 mm + 5 mm/s | ||
75 mm + 5mm/s | ||
200 mm 20 mm/s |
![BT-Product Line Diagram (2)](https://nordko.com/wp-content/uploads/2023/03/BT-Product-Line-Diagram-2.jpeg)